Curved copper plate 50X50.3X1.6mm with 130mm radius. Weight 36g ±.05g. Mounting block 90X90X25mm, Density pcf (kg/m3) 46 (737) Thermal conductivity, 538°C .12 W/m°K per ASTM C177, 130mm radius. High temperature silicon adhesive, 343°C. High temperature coating, absorptivity 0.9 or better. Type T (Cu/Cu-Ni) thermocouple 30 AWG (.254mm). Silver solder to plate. Blue miniconnector.